Improved Methods for Bonding and Grounding (2005-337A-R41)
- Ingalls Shipbuilding
NSRP ASE Investment: $145K
The project objective was to identify what the cost drivers are in accomplishing bonding and grounding in accordance with MIL-STD-1310 and subsequently, propose potential improvements for reducing the costs associated with meeting requirements. The focus areas were carefully selected such that recommended improvements have potential for implementation at any shipyard that is a member of the NSRP Electrical Technologies Panel that constructs ships for the U.S. Navy.
Request Final Report from NSRP– Distribution is Authorized to U.S. Shipbuilding and Repair Industry and NSRP Program Representatives