Improved Bonding and Grounding (2011-452)
- Ingalls Shipbuilding
- General Dynamics Bath Iron Works
- Panduit Corporation
- Avo Training Institute
NSRP ASE Investment: $100K
Bonding and Grounding is time consuming and costly as currently applied. During new ship construction, going to “bright metal” requires removing paint or oxidation from new equipment and foundations. The objective of this project was to identify, test and recommend new technologies that can provide adequate bonding of electrical components to their foundations while meeting Defense Department standards and reducing bonding and grounding costs. This project was conceived under the belief that less expensive methods for bonding and grounding may exist in either private industry or government shipbuilding that could be adopted throughout Navy shipbuilding.
A scientific approach was used to discover and review potential new methods. The final report outlines these potential new methods and presents proposed changes to MIL-STD 1310H Shipboard Bonding and Grounding Methods for EMC and Safety.
Final Report – Approved for public release; distribution is unlimited